DAGE 4600 automated bond-strength testing
Quantifies mechanical strength and failure modes of wire, ball, bump, die and surface-mount bonds while reducing operator variation and improving traceability across larger sample sets.
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SOLUTION RANKPublic-source company profile
Nordson Test & Inspection
Capabilities
X-ray · acoustic microscopy · bond and materials testing
HBM2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYWafer-level interconnect, BGA, substrates and advanced packages2.5D/3D IC, fan-out and power packages
01
Related solutions
C-SAM acoustic microscopy for internal package inspection
Finds delamination, cracks and voids in mold compound, underfill, die attach, TIM and die interfaces without destroying the package.
Official website ↗Official materials
02
Related questions
After C-SAM detects delamination or voiding, how should thermal-warpage data be used to determine whether the defect was pre-existing or propagated under thermo-mechanical stress?
When using the Nordson DAGE 4600 for bond-strength testing, how should pull/shear geometry and sampling be designed to correlate with local warpage without overstating causality?
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