Public-source company profile
Kulicke & Soffa
Capabilities
Thermo-compression · flip chip · wire bonding and advanced packaging
HBM2.5D / 3DFCBGACHIPLET / HYBRID BONDINGPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYPoP, HBM, chiplets, C2S and C2W
Process equipment and thermal controlAPAMA PLUS chip-to-substrate and chip-to-wafer thermo-compression bonding
Fine-pitch flip-chip and stacked packages require controlled temperature, force and flatness to avoid voids, misalignment and joint defects in NCF/NCP/CUF processes.
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