Ajinomoto Build-up Film (ABF) for package substrates
Balances dielectric thickness, surface smoothness, fine-line processability and thermo-mechanical dimensional stability in high-density package-substrate build-up layers.
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SOLUTION RANKPublic-source company profile
Ajinomoto Fine-Techno
Capabilities
Build-up films and interlayer dielectric materials for package substrates
HBM2.5D / 3DFCBGACHIPLET / HYBRID BONDINGHigh-density IC package substrates
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Related solutions
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Related questions
When evaluating Ajinomoto Build-up Film (ABF), how do copper distribution, build-up symmetry and cure conditions interact with material CTE and modulus to drive substrate warpage?
OFFICIAL SUPPLIER ANSWERS