Public-source company profile
Akrometrix
Capabilities
Thermal warpage · Shadow moire · DIC / strain metrology
HBM2.5D / 3DFCBGAFAN-OUT / WLPAUTOMOTIVE / HIGH RELIABILITYWafer, panel and packageBGA, LGA, modules and package-to-board interfaces
Warpage, topography and stress metrologyPS600S thermal warpage metrology system
Measures out-of-plane deformation through a complete heating and cooling profile, exposing warpage reversal, peak deformation and temperature-dependent behavior that room-temperature inspection can miss.
Official website ↗Official materials
Warpage, topography and stress metrologyInterface Analysis for dynamic mating-surface gaps
Components and PCBs or substrates deform differently through a reflow profile. Measuring one surface alone does not show where the mating interface may open, short or create head-in-pillow risk.
Official website ↗Official materials
Warpage, topography and stress metrologyWhen evaluating reflow warpage with the Akrometrix PS600S, when is room-temperature data not enough to predict deformation at peak temperature?
OFFICIAL SUPPLIER ANSWERS
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SOLUTION RANK