Public-source company profile
Altair
HBM, 2.5D/3D IC, FC-BGA and boards
Thermo-mechanical simulation and lifetime predictionSimLab 3D IC thermal-structural warpage and solder-life workflow
Temperature distribution, CTE mismatch, structural deformation and solder fatigue are coupled across 3D ICs, packages, PCBs and cooling paths, and fragmented tools can miss cross-scale effects.
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