Public-source company profile
Alter Technology
Capabilities
Qualification · reliability · failure analysis for high-reliability electronics
FCBGAPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYSiP, chiplets and high-reliability advanced packages
Reliability qualification and failure analysisAdvanced-package screening, qualification and technology analysis
SiP, chiplets and complex IC packages for high-reliability applications need a traceable flow that integrates electrical, environmental, reliability and failure analysis.
Official website ↗Official materials
Reliability qualification and failure analysisWhen ALTER TECHNOLOGY plans qualification for a new 2.5D/3D package, how should standard tests be tailored to avoid missing thermo-mechanical failures unique to its stack and interfaces?
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