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Amkor Technology

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Capabilities

AI/HPC, networking, multi-die and memoryMobile/client logic-memory and stacked packages

Related solutions

Package architecture and warpage compensation

S-SWIFT organic RDL fan-out-on-substrate heterogeneous integration

Large multi-die and memory packages need dense die-to-die interconnects, while full silicon interposers can add thickness, cost, insertion loss and structural-stiffness constraints.

Official website ↗

Official materials

TECHNICAL PAPERHeterogeneous integration using organic interposer technology ↗DATASHEETS-SWIFT technology sheet ↗

Package architecture and warpage compensation

Interposer PoP low-warpage dual-substrate stacked package

Adds stacking flexibility for logic, memory, passives and other devices in compact PoP while controlling unit warpage, top-side I/O density, handling integrity and board-level reliability in a thin package.

Official website ↗

Official materials

DATA SHEETInterposer PoP technology data sheet ↗

Amkor Technology

Related solutions

S-SWIFT organic RDL fan-out-on-substrate heterogeneous integration

Official materials

Interposer PoP low-warpage dual-substrate stacked package

Official materials

Related questions

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