Sherlock physics-of-failure life prediction
Estimates failure risk and relative life under thermal cycling, vibration and mechanical shock before committing to extensive physical builds.
Official website ↗
SOLUTION RANKPublic-source company profile
Ansys, part of Synopsys
Capabilities
Thermo-mechanical stress · electronics reliability · package simulation
HBM2.5D / 3DFCBGAFAN-OUT / WLPCHIPLET / HYBRID BONDINGPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYElectronics assembly, modules and board-level reliabilityHBM, chiplets and 2.5D/3D ICsIC packages, PCBs, AI and power systems
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Related solutions
RedHawk-SC Electrothermal stress and warpage analysis for 3D-ICs
Connects power, thermal gradients, package stress and warpage in 2.5D/3D multi-die systems so structural risks to interconnect and reliability can be found earlier.
Official website ↗Official materials
Icepak–Mechanical coupled thermal-flow and stress analysis for electronics
Airflow and cooling boundaries across packages, boards and systems change component temperature fields, which in turn drive thermal-expansion displacement, solder stress and reliability differences.
Official website ↗Official materials
02
Related questions
When can Ansys Sherlock board-level thermal-cycle predictions be extended to package or chiplet evaluation, and when is a more detailed package FEA required?
When using Ansys RedHawk-SC Electrothermal for 3D-IC analysis, how should power and temperature fields be transferred into the mechanical model to determine whether local hot spots create package warpage or interface risk?
OFFICIAL SUPPLIER ANSWERS