Public-source company profile
Applied Materials
Capabilities
Advanced packaging deposition · plating · hybrid bonding process integration
HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDING3D IC, HBM, CPO and sensors
Process equipment and thermal controlKinex integrated die-to-wafer hybrid bonding system
In multi-die and HBM hybrid bonding, shortens the queue between cleaning, surface activation, placement and metrology to reduce contamination, overlay drift and bond inconsistency.
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