FOCoS high-density fan-out chip-on-substrate
AI/HPC chiplets and HBM need short, dense interconnects and more than 1,000 I/Os while controlling cost, thickness, electrical performance and warpage in large packages.
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SOLUTION RANKPublic-source company profile
ASE
日月光半導體製造股份有限公司
Capabilities
AI, HPC, ML and ASIC-plus-HBM
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