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ASMPT SEMI Solutions

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Capabilities

Thermo-compression bonding · hybrid bonding · advanced packaging assembly

HBM2.5D / 3DFCBGAFAN-OUT / WLPCHIPLET / HYBRID BONDINGPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYHPC, AI, HBM and heterogeneous integration

Related solutions

Process equipment and thermal control

FIREBIRD die-level thermo-compression bonding

2D, 2.5D, 3D and HBM heterogeneous integration require precise die-level control of alignment, force, temperature and bonding time to manage interconnect and package thermo-mechanical risk.

Official website ↗

Official materials

TECHNICAL DISCLOSUREFIREBIRD Series: resource-efficient thermo-compression bonding ↗INVESTOR PRESENTATIONAdvanced-packaging solutions and FIREBIRD thermo-compression bonding ↗

ASMPT SEMI Solutions

Thermo-compression bonding · hybrid bonding · advanced packaging assembly

Related solutions

FIREBIRD die-level thermo-compression bonding

Official materials

Related questions

When using the ASMPT FIREBIRD for thermocompression bonding, how should force, temperature and time windows be established to balance die warpage, interface voiding and bond quality?

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