Public-source company profile

Besi

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Capabilities

Thermo-compression bonding · hybrid bonding · die attach

HBM2.5D / 3DCHIPLET / HYBRID BONDINGPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYDie-to-wafer hybrid bonding and 3D IC

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Related solutions

Process equipment and thermal control

Datacon 8800 CHAMEO ultra plus AC hybrid bonding

Enables clean, accurate, production-rate die-to-wafer placement and bonding at the fine pitches required for high-density 3D integration.

Official website ↗

Official materials

OFFICIAL SPECIFICATIONSDatacon 8800 CHAMEO ultra plus AC product specifications ↗ANNUAL REPORTBesi Annual Report 2025 ↗

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Related questions

Process equipment and thermal control

Before hybrid bonding on the Besi Datacon 8800 CHAMEO ultra plus AC, which coplanarity, particle and overlay metrics should be established to reduce local non-bond and warpage risk?

OFFICIAL SUPPLIER ANSWERS

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