Public-source company profile
Brewer Science
Capabilities
Temporary bonding · debonding · advanced packaging materials
HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGUltrathin wafers, TSV, RDL and 3D WLP
Material properties and interface engineeringWaferBOND HT-10.11 temporary bonding material for ultrathin wafers
Supports wafers below 75 µm through thinning, TSV reveal and backside RDL processing to reduce breakage or excessive deformation during handling, coating, exposure and thermal steps.
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