Public-source company profile

Bruker

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Capabilities

3D optical metrology · X-ray microscopy · materials characterization

HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGDies, bumps and package surfaces

01

Related solutions

Warpage, topography and stress metrology

ContourX-500 non-contact 3D surface and coplanarity metrology

Quantifies surface topography, die flatness, bump height and coplanarity after die and package processing, adding height data that 2D inspection alone cannot provide.

Official website ↗

Official materials

DATASHEETContourX-500 datasheet and product-family brochure ↗

02

Related questions

Warpage, topography and stress metrology

When using the Bruker ContourX-500 for package topography and coplanarity, how should the reference plane, filtering and sampling area be defined to avoid mistaking surface texture for global warpage?

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