Public-source company profile

BTU International

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Capabilities

Reflow and thermal processing for semiconductor packaging

FCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYFlip-chip, 2.5D/3D, WLP and PLP reflow

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Related solutions

Process equipment and thermal control

Pyramax with TrueFlat advanced-packaging reflow and warpage control

Controls temperature uniformity, atmosphere, voiding and high-temperature warpage during reflow for flip-chip, 2.5D/3D, wafer-level and panel-level packaging.

Official website ↗

Official materials

TECHNICAL PAPERReducing CTE mismatch defects in flip-chip reflow ↗

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Related questions

Process equipment and thermal control

When using BTU Pyramax/TrueFlat to support packages during reflow, how should support force and the thermal window be set to avoid residual stress or assembly damage?

OFFICIAL SUPPLIER ANSWERS

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