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Camtek

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Capabilities

Inspection and metrology for advanced packaging and compound semiconductor

HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGMicro-bump, Cu pillar, RDL and hybrid bonding

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Related solutions

Warpage, topography and stress metrology

EagleT-AP 2D/3D inspection and metrology for micro-bumps

Finds height, coplanarity, dimension, placement and surface-defect excursions in dense bump, Cu-pillar, RDL and hybrid-bonding processes.

Official website ↗

Official materials

TECHNICAL DISCLOSURECamtek 2022 annual report: Eagle-AP and EagleT-AP technology ↗

02

Related questions

Warpage, topography and stress metrology

When measuring micro-bump arrays with the Camtek EagleT-AP, which height, coplanarity or defect metrics are most predictive of downstream bonding risk?

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