Public-source company profile
Comet Yxlon
2.5D/3D ICs, TSVs and MEMS
Warpage, topography and stress metrologyCheetah EVO X-ray and laminography inspection for semiconductors
Inspects microbumps, TSVs, die attach and 3D-IC joints for voids, misalignment and hidden defects without destroying the package or committing immediately to cross-sectioning.
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