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COMSOL

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Capabilities

Coupled thermal, structural and electromagnetics multiphysics

HBM2.5D / 3DFCBGAPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYPackage R&D and multiphysics mechanism analysis

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Related solutions

Thermo-mechanical simulation and lifetime prediction

COMSOL Multiphysics for semiconductor packaging

Addresses coupled thermal, structural, fluid, electromagnetic and nonlinear-material effects that single-physics models cannot capture when evaluating warpage, stress and reliability trade-offs.

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Official materials

WEBINARModeling semiconductor packaging in COMSOL Multiphysics ↗TECHNICAL PAPERThermomechanical effects of the packaging molding process on the chip in integrated circuits ↗

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Related questions

Thermo-mechanical simulation and lifetime prediction

When building a package-warpage model in COMSOL, how should cure shrinkage, viscoelasticity and interface contact be calibrated to avoid multiple parameter sets fitting the same warpage curve?

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