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DISCO

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Capabilities

Wafer grinding · dicing · thinning and singulation

HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGPOWER SEMICONDUCTORUltra-thin wafers, power devices and TSVs

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Related solutions

Process equipment and thermal control

TAIKO rim-supported ultra-thin wafer grinding

Wafer thinning sharply reduces stiffness, increasing warpage, handling breakage and edge chipping while complicating downstream metallization, TSV or bump processing.

Official website ↗

Official materials

TECHNICAL BRIEFINGDevice Thinning: TAIKO technical briefing ↗LOCALIZED PAGETAIKO process (Traditional Chinese) ↗

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