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Dow
Capabilities
Silicones · encapsulants · thermal management and assembly materials
2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYCPUs, GPUs, AI accelerators and power modules
Material properties and interface engineeringDOWSIL TC-5888 thin-bondline thermal interface compound
A thick, high-resistance or unstable die-to-lid or lid-to-heatsink bondline can raise junction temperature in high-power CPUs, GPUs and power modules, increasing thermo-mechanical loading across the package.
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