MWAT warpage-adjustment tool for reconstituted wafers
Addresses millimeter-scale warpage in molded reconstituted FOWLP wafers that can disrupt handling, alignment, coating and downstream processing.
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ERS electronic
Capabilities
Wafer and panel warpage measurement · thermal debond process
HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGFOWLP reconstituted wafers in R&D and pilot linesReconstituted, thin and molded wafers
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Related solutions
Wave3000 contactless wafer warp, bow and thickness metrology
Reconstituted and thin wafers can deform by millimeters under different support and temperature conditions, creating a need for fast bow, warp and thickness measurement without surface contact.
Official website ↗Official materials
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Related questions
When using the ERS Wave3000 to compare reconstructed-wafer warpage before and after processing, how should support mode, edge exclusion, thermal stabilization and repeat measurements be set to separate real shape change from measurement bias?
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