Public-source company profile

ESPEC

Official website ↗Send contact request ↗Claim this company profile ↗

Capabilities

Temperature, humidity, thermal shock and accelerated reliability testing

FCBGAPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYBGA, CSP, interconnects and power packagesAdvanced packages, automotive, industrial and board-level joints

Related solutions

Reliability qualification and failure analysis

TSA air-to-air thermal shock and interconnect reliability testing

Rapid hot-cold transitions create expansion mismatch, fatigue, cracks, delamination and intermittent continuity failures in heterogeneous package and interconnect materials, requiring repeatable accelerated testing.

Official website ↗

Official materials

PRODUCT CATALOGTSA Series air-to-air thermal shock chambers ↗

Reliability qualification and failure analysis

TCC 20 K/min rapid-rate thermal cycling for interconnect fatigue

Advanced packages and automotive electronics repeatedly expand and contract under controlled ramp rates, accumulating fatigue in solder joints, microbumps, interfaces and materials; this requires cycling distinct from abrupt thermal shock.

Official website ↗

Official materials

CATALOGSemiconductor reliability-test equipment lineup ↗CATALOGTemperature, humidity and rapid-rate chamber catalog ↗

ESPEC

Temperature, humidity, thermal shock and accelerated reliability testing

Related solutions

TSA air-to-air thermal shock and interconnect reliability testing

Official materials

TCC 20 K/min rapid-rate thermal cycling for interconnect fatigue

Official materials

Related questions

Official supplier answers will appear here after the company claims this profile and a response is published.