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Eurofins EAG Laboratories

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Capabilities

Materials characterization · failure analysis · reliability testing

HBM2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITY3D package, WLCSP, flip-chip and assembly failures

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Related solutions

Reliability qualification and failure analysis

Advanced-package fault isolation and root-cause analysis

Traces hidden or intermittent failures in 3D packages, stacked dies, flip-chip, underfill and multi-material assemblies from observed symptoms to physical root cause.

Official website ↗

Official materials

SERVICE GUIDEFailure analysis of ICs and components ↗

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Related questions

Reliability qualification and failure analysis

When intermittent failures appear after thermal cycling, how should Eurofins EAG sequence electrical localization, non-destructive inspection and cross-sectioning to preserve evidence and trace interface damage?

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