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Filmetrics
Wafers, dies, RDL, films and MEMS
Warpage, topography and stress metrologyProfilm3D white-light interferometry for surface topography and bow
Non-contact measurement of step height, roughness, waviness, bow, shape and defect topography on wafers, dies, RDL, coatings and package surfaces without dragging a stylus across soft materials.
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