Public-source company profile
Henkel Adhesive Technologies
Capabilities
Underfill · encapsulation · thermal interface · package reliability
HBM2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYLarge-die flip-chip BGA and Cu pillarAI/HPC, 2.5D/3D and large flip-chip packages
Material properties and interface engineeringLOCTITE ECCOBOND UF 9000AE underfill for large dies
Reduces concentrated solder-joint stress and die warpage caused by CTE mismatch among large flip-chip BGA or Cu-pillar dies, substrates and interconnects during reflow and thermal cycling.
Official website ↗Official materials
Material properties and interface engineeringLid and stiffener attach adhesives for advanced packages
Large AI/HPC and heterogeneous packages can develop warpage, coplanarity and interface-reliability issues from CTE mismatch, lid or stiffener architecture and non-uniform bondlines during assembly and thermal cycling.
Official website ↗Official materials
Material properties and interface engineeringFor large-die applications using Henkel LOCTITE ECCOBOND UF 9000AE, how should cure shrinkage, modulus, Tg and adhesion be balanced against warpage and solder fatigue?
OFFICIAL SUPPLIER ANSWERS
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