Public-source company profile
Heraeus Electronics
Capabilities
Die attach · sintering · bonding wire · thermal management materials
HBM2.5D / 3DFCBGAPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYPower devices, RF PAs, MOSFETs and diodes
Material properties and interface engineeringmAgic DA295A low-temperature pressureless silver-sinter die attach
High-power semiconductors need lower thermal resistance and higher operating temperature than conventional conductive adhesives or high-lead solder, without the mechanical load and process disruption of pressure sintering.
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