Heat-Spring HSx compressible metal thermal interface
Addresses uneven gaps between large, curved or warped dies and heat spreaders where conventional thin TIMs may lose contact and create local thermal resistance or hotspots.
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SOLUTION RANKPublic-source company profile
Indium Corporation
Capabilities
Thermal interface · die attach · semiconductor assembly materials
HBM2.5D / 3DFCBGAPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYHigh-power dies, burn-in and liquid-cooled systemsIGBT and SiC modules, DBC/AMB and baseplates
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Related solutions
InFORMS reinforced solder preforms for controlled bondlines
Tilt and uneven bondline thickness in DBC/AMB substrate, spacer or baseplate attachment can create stress concentrations, voiding and thermal-cycle fatigue, amplifying CTE-mismatch effects in power modules.
Official website ↗Official materials
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Related questions
When using Indium Heat-Spring HSx as a compressible metal TIM, how do contact pressure, tolerances and long-term stress relaxation affect thermal resistance and package mechanical stress?
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