Public-source company profile
Instron
ICs, BGAs, chip-on-film, stacked packages and substrates
Reliability qualification and failure analysisThree- and four-point bend testing for microelectronic packages
Thin, multilayer and stacked packages experience mechanical bending during PCB assembly, board flex and use, which can trigger die cracking, delamination, joint failure or fatigue. Material datasheets alone do not represent the assembled stack.
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