Public-source company profile

Integrated Service Technology (iST)

宜特科技股份有限公司

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Capabilities

Reliability verification · material analysis · failure analysis

HBM2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYBGA, CSP and non-hermetic IC packagesUnderfills, molds, adhesives, substrates and films

Related solutions

Reliability qualification and failure analysis

HAST moisture-acceleration reliability validation and anomaly analysis

Accelerates moisture ingress, corrosion, electrochemical migration and related package failure risks under high temperature, humidity and electrical bias.

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Official materials

TECHNICAL ARTICLEPreventing electrochemical migration in HAST ↗APPLICATION NOTEBurn-in boards and HAST/THB verification ↗

Reliability qualification and failure analysis

TMA, DMA and DSC thermal characterization for advanced-packaging materials

Using datasheet CTE, Tg and modulus values measured by different methods can create false comparisons and poor thermo-mechanical model inputs for underfills, mold compounds, adhesives and substrates.

Official website ↗

Official materials

SERVICE PAGETMA measurement of CTE, Tg, shrinkage and time to delamination ↗TECHNICAL ARTICLEThermal characterization of advanced-packaging materials (Traditional Chinese) ↗

Integrated Service Technology (iST)

宜特科技股份有限公司

Reliability verification · material analysis · failure analysis

Related solutions

HAST moisture-acceleration reliability validation and anomaly analysis

Official materials

TMA, DMA and DSC thermal characterization for advanced-packaging materials

Official materials

Related questions

During iST HAST testing, how can teams distinguish moisture- or bias-driven failures from defects initiated by warpage or interface stress?

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