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k-Space Associates

Capabilities

Wafers, thin films and annealing

01

Related solutions

Warpage, topography and stress metrology

kSA MOS ThermalScan temperature-dependent wafer curvature and film-stress metrology

Shows how wafer bow, curvature and film stress evolve during annealing, thermal cycling or controlled atmospheres, capturing behavior that pre/post measurements miss.

Official website ↗

Official materials

DATASHEETkSA MOS ThermalScan product specifications ↗

02

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