Public-source company profile
KLA
Capabilities
Advanced packaging inspection · substrate and panel metrology
HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGWLCSP, FOWLP, TSV and 2.5D/3D
Warpage, topography and stress metrologyCIRCL-AP all-surface inspection and 2D/3D metrology for wafer-level packaging
Defects from thinning, bonding and RDL/TSV processing can appear on the front, back and edge of a wafer together with dimensional excursions in bumps, RDL or edge trim.
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