Public-source company profile
Koh Young Technology
Capabilities
3D optical inspection · solder and assembly process analytics
FCBGAPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYMicro-solder, flux, bumps and high-density substrates
Warpage, topography and stress metrologyMeister S True3D inline metrology for micro-solder and flux
Inspects micro-solder deposits, transparent flux, reflective surfaces and substrate warpage inline for fine-pitch advanced packaging and Mini/Micro-LED processes, enabling earlier feedback on print or deposition excursions.
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