Public-source company profile
Kyocera
Capabilities
Ceramic packages · substrates · metallization and thermal solutions
HBM2.5D / 3DFCBGAPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYLarge HDBU and chiplet package substrates
Package architecture and warpage compensationMultilayer ceramic core substrate for advanced HDBU packaging
Addresses warpage in large HDBU and chiplet packages when organic cores lack stiffness during build-up, die mounting and thermal processing, while alternative cores may introduce stress and cracking concerns.
Official website ↗Official materials
Package architecture and warpage compensationWhen using a KYOCERA HDBU multilayer ceramic-core substrate to reduce package deformation, where do CTE, stiffness and copper stack-up shift stress within the interfaces?
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