Public-source company profile
Lam Research
Capabilities
Deposition · etch · clean and advanced packaging process equipment
HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGTSV, RDL, copper pillars, microbumps and HDFO
Process equipment and thermal controlSABRE 3D electrochemical deposition for advanced packaging
Balances void-free fill, within-wafer and within-die uniformity, coplanarity, defectivity and plating rate across TSV, RDL, copper-pillar, UBM and microbump deposition, reducing downstream CMP, bonding and reliability risk.
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