Public-source company profile

MA-tek

閎康科技股份有限公司

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Capabilities

Semiconductor materials analysis · failure analysis · reliability

HBM2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITY2.5D/3D IC, TSV and flip-chip

Related solutions

Reliability qualification and failure analysis

Multi-technique failure analysis and reliability verification for advanced packaging

Investigates delamination, cracks, voids, electrical shifts and interface degradation after reflow, thermal cycling or field use, moving from non-destructive localization to cross-section and material root cause.

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Official materials

APPLICATION GUIDEIC packaging testing and multi-technique analysis ↗SERVICE NOTESAT analysis of package delamination, cracks and voids ↗