Public-source company profile
MacDermid Alpha Electronics Solutions
Capabilities
Solder, sintering, plating and semiconductor assembly materials
HBM2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYPLP, reconstituted panels and RDL interfaces
Material properties and interface engineeringPackageBond copper-polymer adhesion promotion for panel-level packaging
Large reconstituted panels can crack, blister, delaminate or warp at copper-polymer interfaces during molding, RDL, reflow, moisture exposure and thermal cycling.
Official website ↗Official materials
No related questions have been added yet.
OFFICIAL SUPPLIER ANSWERS
Official supplier answers will appear here after the company claims this profile and a response is published.
