Public-source company profile
Moldex3D
科盛科技股份有限公司
Transfer/compression molding, FOWLP and molded underfill
Thermo-mechanical simulation and lifetime predictionIC Packaging Warp simulation for molding, cure and cooldown
EMC/LMC packages develop flow imbalance, chemical shrinkage, thermal shrinkage and stress relaxation from filling through cure and cooldown, making final warpage difficult to predict with linear thermal stress alone.
Official website ↗Official materials
Thermo-mechanical simulation and lifetime predictionWhen using Moldex3D IC Packaging Warp to model molding, cure and cool-down warpage, how should sensitivity analysis cover material inputs and process conditions so that a good numerical fit does not hide the wrong deformation mechanism?
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