Chipcoat G8345 low-warpage dam-and-fill encapsulants
Wire-bonded CSP/BGA packages need encapsulation without disturbing wires while controlling cure shrinkage, CTE mismatch and package warpage.
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NAMICS
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Underfill · encapsulants · conductive adhesives for advanced packaging
HBM2.5D / 3DFCBGAFAN-OUT / WLPCHIPLET / HYBRID BONDINGAUTOMOTIVE / HIGH RELIABILITYWire-bonded CSP/BGA and local liquid encapsulation
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