Public-source company profile
Nikon Industrial Metrology
Capabilities
Industrial X-ray and CT inspection for electronics and assemblies
2.5D / 3DPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITY2.5D/3D IC, BGA, fan-out and modules
Warpage, topography and stress metrologyXT H 225 ST 2x non-destructive 3D X-ray CT for advanced packages
Voids, cracks, misalignment and geometric anomalies inside stacked dies, interposers, underfill, solder joints and substrates are often hidden from visual and surface-warpage inspection.
Official website ↗Official materials
Warpage, topography and stress metrologyWhen inspecting large 2.5D/3D packages with the Nikon XT H 225 ST 2x, how should field of view, voxel size, scan time and metal artifacts be balanced, and what methods should confirm suspected micro-bump or interface defects?
OFFICIAL SUPPLIER ANSWERS
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