Firefly G5 panel-level packaging inspection and 3D metrology
Finds surface residue, pattern defects, embedded defects and critical 3D dimensional excursions across large advanced-packaging substrates and panels.
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SOLUTION RANKPublic-source company profile
Onto Innovation
Capabilities
Advanced packaging inspection · 2D / 3D metrology · process control
HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGAdvanced IC substrates and panel-level packagingRDL, micro-bumps, hybrid bonding and HBM
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Related solutions
Dragonfly G3 2D/3D inspection and metrology for advanced packaging
High-density RDL, micro-bump, Cu-pillar, reconstructed-wafer and hybrid-bonding processes need sub-micron defect inspection together with height, profile and surface-condition metrology.
Official website ↗Official materials
02
Related questions
When inspecting panel-level packages with the Onto Innovation Firefly G5, how can teams separate local 3D dimensional excursions from overall panel warpage, and what should be used for cross-validation?
When transferring an Onto Innovation Dragonfly G3 2D/3D inspection recipe across materials and layouts, how should false-positive rates and measurement repeatability be validated?
OFFICIAL SUPPLIER ANSWERS