Public-source company profile
Palomar Technologies
Capabilities
Precision die attach · wire bonding · vacuum reflow
2.5D / 3DFCBGAPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYPhotonics, MEMS, power, RF and sensors
Process equipment and thermal control3880-II multi-process automated die bonder
Manages multiple die-attach materials, thermal profiles, component formats and traceability on one platform for high-mix development through volume production in advanced packages, photonics, MEMS and power devices.
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