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Panasonic Industry

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Capabilities

Low-loss laminates · encapsulation and electronic materials

HBM2.5D / 3DFCBGACHIPLET / HYBRID BONDINGPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYCPU, GPU, FPGA and ASIC FC-BGAFOWLP, FIWLP, PLP and mobile modules

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Material properties and interface engineering

R-1515V low-CTE, stress-relaxing FC-BGA substrate material

FC-BGA substrates for large CPUs, GPUs, FPGAs and ASICs need to reduce both package warpage and residual stress on solder balls during motherboard reflow.

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Official materials

TECHNICAL RELEASER-1515V low-warpage and assembly-reliability technical release ↗PRODUCT PAGEMEGTRON GX IC-substrate material family ↗

Material properties and interface engineering

CV8511C / CV5788 low-warpage encapsulation for FOWLP and PLP

Large wafer- and panel-level fan-out structures can warp after overmolding and cooldown because of mold-compound shrinkage, CTE and modulus mismatch, disrupting grinding, RDL, singulation and assembly.

Official website ↗

Official materials

DATASHEETCV8511C / CV5788 encapsulation materials for FOWLP/PLP ↗

Panasonic Industry

Low-loss laminates · encapsulation and electronic materials

Related solutions

R-1515V low-CTE, stress-relaxing FC-BGA substrate material

Official materials

CV8511C / CV5788 low-warpage encapsulation for FOWLP and PLP

Official materials

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