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Polytec
Wafers, BGA, MEMS and die-bonding surfaces
Warpage, topography and stress metrologyTopMap Micro.View CSI 3D metrology for microstructures and BGA
Measures roughness, step height, flatness, topography and local warpage on wafers, MEMS, BGA, die-bonding surfaces and microstructures without stylus contact or loss of fine surface detail.
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