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Powertech Technology Inc. (PTI)
力成科技股份有限公司
CPUs, GPUs, FPGAs, memory and multi-die packages
Package architecture and warpage compensationCLIP chip-last panel-level fan-out packaging
Embedding high-value or thermally sensitive CPUs, GPUs, FPGAs and other dies before panel RDL formation exposes them to extra thermal history and process-loss risk, while multi-die integration also demands fine routing, yield control and package-shape management.
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