Public-source company profile
PVA TePla
Capabilities
Plasma systems · ultrasonic microscopy · thermal process equipment
2.5D / 3DFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYFO-PLP, panel packages and power modules
Warpage, topography and stress metrologySAM Auto Panel acoustic inspection for panel-level packaging
Finds delamination, voids, cracks, bonding defects and thickness variation in fan-out panels and multilayer packages where optical inspection or conventional X-ray may be insufficient.
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