MCL-E-770G Type R/RLH low-warpage package substrate material
Targets package warpage in FC-CSP, PoP and SiP substrates driven by CTE mismatch and insufficient stiffness.
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SOLUTION RANKPublic-source company profile
Resonac
Capabilities
Low-CTE laminates · packaging materials · warpage control
HBM2.5D / 3DFCBGAFAN-OUT / WLPCHIPLET / HYBRID BONDINGPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYFC-CSP, PoP and SiP substratesFlip-chip and high-density package substrates
01
Related solutions
SR7300 / SR-F low-CTE, low-shrinkage solder resist for package substrates
High CTE or cure shrinkage in package-substrate solder resist can add substrate warpage, reflow stress and thermal-cycling crack risk.
Official website ↗Official materials
02
Related questions
When evaluating Resonac MCL-E-770G Type R/RLH, how should CTE, modulus and material thickness be weighed together when assessing warpage reduction?
OFFICIAL SUPPLIER ANSWERS