Public-source company profile
Rigaku
Capabilities
X-ray diffraction, imaging and materials analysis
HBM2.5D / 3DFAN-OUT / WLPPOWER SEMICONDUCTORRDL, UBM, metallization and coatings
Warpage, topography and stress metrologySmartLab SE XRD analysis of thin-film residual stress and texture
RDL, UBM, metallization and thin films develop residual stress from deposition temperature and CTE mismatch, potentially causing cracks, local buckling, delamination or substrate deformation.
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