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Samsung Foundry

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Capabilities

AI/HPC, logic-memory and 3D systems

Related solutions

Package architecture and warpage compensation

3D X-Cube / 3D Cube vertical die-stacking platform

AI/HPC and high-bandwidth systems need shorter logic-memory links, greater density and lower monolithic-die area/yield risk while managing thermal and mechanical load in vertical stacks.

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Official materials

TECHNICAL ARTICLESamsung advanced packaging and system-level innovation ↗

Samsung Foundry

Related solutions

3D X-Cube / 3D Cube vertical die-stacking platform

Official materials

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