Public-source company profile
SET Corporation
Capabilities
High-accuracy flip-chip and chip-to-chip bonding
HBM2.5D / 3DCHIPLET / HYBRID BONDINGPOWER SEMICONDUCTOR3D IC, memory stacking, CPO and sensors
Process equipment and thermal controlFC300 high-accuracy, high-force flip-chip bonder
Controls force, temperature, parallelism and post-bond placement together for large chip-to-wafer and fine-pitch 3D or memory stacking, reducing nonuniform loading and interconnect misalignment.
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