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Shin-Etsu Chemical

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Capabilities

Wafer molding, power modules and semiconductor devices

Related solutions

Material properties and interface engineering

KMC low-warpage, thermally conductive epoxy encapsulants

Balances protection, heat flow, moldability, material stress and post-cure warpage in encapsulated semiconductor devices, especially large or high-power packages.

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Official materials

PRODUCT BROCHUREThermally conductive KMC semiconductor encapsulants ↗MATERIAL DATAPower-device molding materials and reliability data ↗

Shin-Etsu Chemical

Related solutions

KMC low-warpage, thermally conductive epoxy encapsulants

Official materials

Related questions

When evaluating Shin-Etsu KMC low-warpage, thermally conductive epoxy encapsulants, which flow, cure-shrinkage, moisture, adhesion and reliability tests are needed beyond CTE, Tg and thermal conductivity to judge whether a highly filled grade fits the actual stack?

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